翻译资格考试中级英语笔译词汇：生产流程

　　Manufacturing Process 生产流程

　　Printed Circuit Board Process Flowchart 流程图

　　i) inneriayer 内层

　　1. Chemical Cleaning: Removes the anti-tarnish coating, dirt, grease, from the copper ciad laminate.

　　化学清洗：去除铜箔面上的氧化层、不光泽物、污物和油脂。

　　2. Dry Film Lamination: Application of an UV sensitive film to the cleaned surface of the copper laminate through controlled heat and pressure. The line includes material surface preparation, CSL, loader and Stacker.

　　在清洁的覆铜板两面贴上一层UV光敏材料―――干膜、贴膜通常在全自动贴膜机上完成，在加热加压的条件下将干膜粘贴在覆铜板面上。干膜中的抗蚀剂层受热后变软，流动性增加，借助于热压辊的压力和抗蚀剂粘结剂的作用完成贴膜。

　　3. Dry Film Exposure: A negative phototool or artwork is imaged into the dry film, on both sides of the copper clad, through UV light exposure leaving a positive image in the dry film.

　　During exposure the UV energy is absorbed by the dry film directly underneath the clear areas of the overlaying artwork, causing it to polymerize and harden. The film covered by dark areas of the artwork remains soft.

　　曝光：将负片底片覆盖在覆铜板两面，经过紫外光照射曝光后在干膜上产生正片图像。

　　曝光过程是在紫外光照射下，未被底片挡住部分的干膜中的光引发剂吸收光能分解成洲离基，游离基再引发聚合单体进行交联反应，反应后生成不溶于稀碱溶液的体形大分子结构人。

　　4. Dry Film Developing: After the dry film is imaged, the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected.

　　显影：干膜中未曝光部分的活性基因与稀碱溶液反应生成可溶性物质而溶解下来，曝光部分的干膜不被溶解。

　　5. Copper Etch: The remaining hardened dry film on the copper acts as a “Resist” and the unprotected copper is chemically dissolved or etched.

　　蚀刻：保护性的干膜再覆铜板上形成图像，那些显影掉，未被干膜保护的不需要的铜膜，在化学蚀刻工序中被蚀刻掉。

　　6. Strip Resist: The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork. The lnner-layer image transfer process has been completed.

　　去膜：蚀刻后将抗蚀层干膜去除，得到所需的裸铜电路图图。内层图形转移过程就这样完成了。

　　7. Post-Etch-Punch(PEP): This　process punches tooling holes which are used to align inner-layer cores in subsequent processes.

　　冲孔：冲孔机冲的孔用于下工序内层定位。冲孔机利用带靶形的摄像系统在铜板上定位，冲出的孔有非常高的精确度。

　　8. Automated Optical Inspection (AOI)： lnner-layer cores are inspected with the use of a comouter aided optical inspection system to locate any pattern defect that may have occurred during the image transfer process.

　　The AOI process uses a datafile generated at CAM, the machine compares the image scaned versus a graphic computer file. AOI benefits consist of early detection of process deviations, reduction of finat test fallout’s, consistent line width and tolerances. Repairs can be made here to weld innerlayer opens or trim innerlayer shorts per customer specifications.

　　自动光学检测(AOI)：AOI机主要利用电脑辅助光学系统检测内层光成像中产生的缺陷。

　　AOI用计算机制作数据测试文件，将扫描的图形与计算机图解文件时行对照，AOI的优点在于尽早检测出内层产生的偏差、线宽公差、减少最终检验报废，检测出的内层/短路可进行返修。

　　Critical Factors for Fine Line Resolution 细线路生产影响因素

　　·Tightly controlled clean room temperature and relative humidity

　　严格控制室内的温度与相对湿度

　　·Room and equipment cleanliness 保持室内与设备清洁无尘

　　·Collimated light sources 曝光机紫外光光源平行

　　·Total UV exposure 曝光充分

　　·Intimate phototool and dry film contact 底片与干膜紧密结合

　　·Adequate exposing energy/time 适当的曝光能量/时间

　　·Good dry film adhesion to copper foil 良好的干膜与铜面粘接

　　·Tight chemistry controls on develop/etch/strip lines

　　显影/蚀刻工序中严格的化学控制

　　·Good fluid spray patterns 好的喷淋显影点控制

　　·Reduced copper foil thickness 减少铜箔厚度

　　Coretec production capability is presently 5 mil line/5 mil space(+/- 1 mil), commonly in 1/2 to 1 oz copper.

　　目前一般的生产能力：铜箔厚度0.5或10OZ;5mil线宽，5mil线距(+/-mil)

　　9. Inner-layer Oxide: This process is designed to intentionally create a coating of copper oxide onto the copper circuitry to enhance the surface topography. This will increase the bond strength between the core and the bonding materials used in the multi-layer laminateon.

　　内层黑化：为提高铜表面与预浸材料之间在层压后的结合力所采用的氧化处理工艺。对铜表面进行化学氧化(黑化)，使其表面生成一层氧化物(黑色的氧化铜或棕色的氧化亚铜或两者的混合物)，以进一步增加比表面，提高粘结力。

　　ii) Multilayer 层压

　　Vacuum Press Lamination: Lamination is the process of bonding cores together to form a multi-layer panel. Lnner-layer oxidized cores are stacked up with prepreg and copper foils, depending on the type of build. Multi-layers are laminated using a Hydraulic Press.

　　Coretec utilizes a Vacuum Assisted Hydraulic Press which improves resin flow and increases moisture/volatiles removal. The press utilizes an automatic cure cycle control which supplies heat/pressure/vacuum. The presses are coupled with a controlled cooling cycle under pressure to reduce warpage.

　　层压是借助于B-阶粘结片把各层线路薄板(内层、半固化片、铜箔)粘结成一整体的一个生产过程。层压机可以分为非真空液压和真空压机。

　　真空层压易于树脂流动量，不易出现白班或裂纹。真空压机通过制动加热循环控制系统，提供热量/压力/真空度，压机通过冷却控制系统在一定压力下进行板冷却，减小翘曲发生。

　　iii) NC Drilling 数控钻孔

　　Panels arriving from the vacuum press will be drilled to create interconnections between the different layers of the circuitry.

　　The drills are CNC controlled and receive files from CAM which contain the number of hits, hole sizes, and the path for the drill head to follow.

　　层压后到钻孔工序进行孔加工，使各层线路间形成网络连接。

　　数控钻机从CAM中接受数据文件，包括钻孔数、孔大小及钻孔路径。

　　·Panels from the lamination presses are first routed and edge beveled to clean up the edges of the panels. The tooling holes are spot faced to allow the panels to lie flat on the drill table.

　　层压后先裁连，以使板连平整。铣出定位孔处的铜箔，用冲孔机冲出定位孔。

　　Panels are drilled typically in stacks of 3 high + entry foil & backup material.

　　一般是钻3个定位孔。

　　·Larger drills may process 4-5 panel stacks simultaneously.

　　大孔可以4-5叠板同时钻。

　　·Tool management system provides storage for up to 120 drills per spindle, automatic tool change when maximum hits reached.

　　钻刀库可以存放120把刀每个钻轴，在钻孔时可以自动的更换钻刀。

　　·Drill ROM and plunge speed are automatically adjusted for each drill size.

　　钻速与进给速度根据钻刀大小来调节。

　　·Typical panels have 10000-12000 holes (some as much as 30K).Takes approx. 1 hour to process.

　　一般的板要钻10000-12000个孔(最多可达到3万)，大约需钻一个小时。

　　·Panels are checked with X-Rays for hole Registration in inner-layers.

　　Introduction of scale factor may be necessary to center drill pattern to copper pattern.

　　X-Ray机可以测量内层上的孔位置精度，通过涨缩系数的调整是必要的，可以使钻孔与导体图形对正。

　　·Smallest drill hole capability is 13.5 mil diameter with a drill aspect ratio of 6:1.

　　最小能钻直径直径为13.5mil的孔，最小板厚孔径为6：1。

　　Deburring As drill removes copper a small copper ridge forms around the hole edge. The burr is mechanically removed using scrubbing brushes and high pressure water blast to remove any debris from the holes.

　　去毛刺-钻孔后会在铜箔和孔壁上产生粗糙边。用机械方法(通常是用旋转的、含磨料的尼龙刷辊及高压水流水洗)去除毛刺。

　　iv) Electroless Crpper 沉铜

　　Desmear: Friction during drilling causes the drill to heat-up and melt the resin between copper layers. As the drill is removed. The soft resin will smear across internal conductors. The smeared resin will prevent electrical connect on to innerlayers, it must be removed by chemical or plasma attack. Coretec utilizes a chemical permanganate desmear process.

　　Etchback: Some specifications require electrical connection to three surfaces on internal conductors, hence in addition to desmear, additional resin and glass fibre must be relieved from the hole wall to allow access to three side of internal conductors. This is know as “positive etchback”. Usually a military-only requirement.

　　除胶：钻孔时的磨擦使钻刀升温，使得孔内板材中的树脂熔化。随着钻刀的移动，熔化的树脂会粘污到内层的导线上。因其妨碍内层连接的可靠性，所以必须用化学(高锰酸钾)或等电子方法清除。

　　凹蚀：某些标准要求内层铜的三面都同电镀铜层连接，因此通过除胶过程可以将树脂和玻璃纤维从孔壁上咬蚀掉一部分，使镀层与内层达到三面联接的效果，这常常叫做“正凹蚀”，通常军标也提出类似要求。

　　Electroless Copper is a chemical metalization process intended to metallize the surface of dielectric material at the hole wall and institute electrical connection between all exposed copper surfaces. The process deposits a very thin(75 micro-inches), fragile coating of pure copper over the entire surface of the panel, this includes the drilled hole walls and the external surfaces.

　　化学沉铜：为了使孔壁上不导电的树脂及玻璃能够导电，进行化学沉铜，使孔壁与板面上沉上的一层很薄的铜层，只有大约75微英寸厚(0.5mil)，再通过全板电镀，使板面和内层铜联接起来。

　　v) External Imaging 外光成像

　　Dry Film Lamination: Just as in inner layer, photosensitive dry-film is laminated on both sides of the panel.

　　贴干膜：与内层相同，将干光性干膜帖覆在两边板面上。

　　Dry Film Exposure: A positive image is used to create a negative(reverse) image of the external circuitry onto the dry-film, note that the dark areas of the artwork cover the panel holes. The film and the artwork are exposed to UV light and the external image is created.

　　曝光：用正像的菲林产生负像的线路图形，菲林上黑色图形区域将板面上的孔覆盖，菲林与干膜经紫外光曝光后产生图形。

　　Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a “channel”for copper pattern plating to take place.

　　显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。

　　vi) Wet Processes 湿流程

　　Copper Plating: Copper is electrodeposited onto the copper foil that is outlined by the dry film. Copper is plated on the surface and in the holes of the panel. The panels are suspended in an acid-copper bath along with copper anode balls. Current from a DC rectifier drives copper to be consumed from the anodes and deposited on the plated surfaces. Organic compounds are also introduced to the plating baths to control deposition rates.

　　Tin plating: Immediately after copper plating, a thin layer(0003”) of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process.

　　镀铜：图形转移完成后将进行图形电镀。在表面线路与孔壁都镀上一层铜。简单的介绍电镀过程：将板侵入装有铜阳级的酸性溶液中，在直流电流作用下，铜离子离开铜阳极表面，沉积到板面线路与孔壁上，镀铜缸内加入了添加剂以控制铜离子的沉积速率。

　　镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。

　　Dry Film Strip: Removes the plating resist exposing the base copper underneath. The plated copper remains, protected by the tin plating etch resist.

　　去膜：蚀刻后露出的铜箔被蚀去，留下镀上锡保护的线路部分。]

　　Copper Etch: The exposed copper is removed through an etching process, while the plated tin acts as a resist-protecting the plated copper from the etchant.

　　去锡：除去镀锡层，显现出线路部分的铜线。(铜线由三层构成：基铜层、沉铜层和电镀铜层)

　　vii) Soldermask 阻焊

　　Solder mask on Bare Copper(SMOBC): Solder mask is an insulative protective coating that is applied to the external circuitry after the SES process. Soldermask serves two purposes:

　　to electrically isolate copper features on the surface of the board.

　　to protect the coated copper from mechanical and environmental damage.

　　Coretec uses only liquid photoimageable soldermask(LPISM)for best resoluteion and ease of processing. Other processes(dry film, silkscreen)less common. Semi-gloss is standard, matte finishes also available.

　　PISM must be used in conjunction with “button print” operation to plug via holes.

　　裸铜覆阻焊膜工艺(SMOBC)：是一种保护层，涂覆在板不需焊接的线路和基材上，目的是防止焊接时线路间产生桥接，同时保护线路图形在机械和化学环境安全。

　　使用液态光成像阻焊效果好，也容易处理，其他的保护层如干膜和热固油墨等使用较少，另外哑光油墨(不光泽、不光滑的)也有一部分使用。

　　塞孔技术使用“点图”将导通孔塞住。

　　Photoimageable Soldermask Application: 工艺要点

　　1. Surface Cleaning: Removes oxide and contaminants by AlO2 scrubbing the panel.

　　表面清洁处理：去除板面氧化膜、污物，通常使用氧化铝粉磨板机处理。

　　2. Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.

　　网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。

　　3. Tack Dry: evaporate the mask solvents and cure the mask sufficiently to be handled in exposure step.

　　预烘：预烘的目的是使阻焊层进行热固化，有利与曝光一步的处理。

　　4. Exposure: PISM acts similarly to a Dry-Film, a negative artwork is used to create the image of the solderable are as like SMT pads, PTH. The solder mask is exposed to UV light in a controlled environment such as in inner or outer-layer.

　　曝光：使用负性菲林图形，将焊盘、SMT和孔位挡住，未挡住的油墨受紫外光照射后，发生光固化。

　　5. Develop: The unexposed PISM is developed away, leaving the solderable pads exposed.

　　显影：未曝光的部分阻焊膜显影时除去，已曝光部分留存。

　　6. Thermal Cure: The panels go through a controlled cure cycle(300 deg F)to haren the soldermask and make it a permanent board finish.

　　固化：固化的目的是使阻焊膜完全硬化交联，在140-150℃烘箱中40-60分钟即完成。

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